摘要
以柔性器件封装为背景,引入双硫键和金属配位键,室温固化制备自修复聚氨酯复合基板(PUE3).基体中存在锂离子迁移所需要的无定形相,在60℃时离子导电率为1.14×10^(-4) S·cm^(-1),在40℃下修复4 h,PUE3拉伸强度3.6 MPa,修复效率85.7%,利用双硫键、配位键和氢键动态交联,协同提升PUE3自修复能力。实现PUE3与Al箔的静电键合连接,PUE3-Al界面拉伸强度达3.8 MPa.
This study focuses on the fabrication of a self-healing polyurethane composite substrate(PUE3)for flexible device packaging by incorporating dynamic disulfide bonds and metal-coordination bonds through room-temperature curing.The amor⁃phous phase within the PUE3 matrix facilitates lithium-ion migration,achieving an ionic conductivity of 1.14×10^(-4) S·cm^(-1) at 60℃.After healin at 40℃ for 4 h,the repaired PUE3 demonstrates a tensile strength of 3.6 MPa with a healing efficiency of 85.7%,at⁃tributed to the synergistic interplay of dynamic disulfide bonds,metal-coordination bonds,and hydrogen bonds within the crosslinked network.Furthermore,the PUE3 substrate was successfully bonded to aluminum(Al)foil via electrostatic bonding,with the PUE3-Al interface exhibiting a tensile strength of 3.8 MPa.
作者
赵浩成
姚志广
张志超
梁芳楠
尤雪瑞
ZHAO Hao-cheng;YAO Zhi-guang;ZHANG Zhi-chao;LIANG Fang-nan;YOU Xue-rui(Faculty of Energy Chemistry and Materials Engineering,Shanxi Institute of Energy,Jinzhong Shanxi 030600,China;Faculty of Mechanical and Electrical Engineering,Shanxi Institute of Energy,Jinzhong Shanxi 030600,China)
出处
《铸造设备与工艺》
2025年第3期49-52,64,共5页
Foundry Equipment & Technology
基金
山西省自然科学基金(202203021211284)。
关键词
静电键合
自修复
柔性器件
封装
聚氨酯
electrostatic bonding
selfreparing
flexible device
encapsulation
polyurethane
作者简介
赵浩成(1985-),男,山西朔州人,博士,副教授,主要从事柔性器件封装材料研究工作。
