摘要
基于MCM-D薄膜工艺,开展了3D-MCM相关的无源元件内埋置、芯片减薄、芯片叠层组装、低弧度金丝键合、芯片凸点,以及板级叠层互连装配等工艺技术研究。通过埋置型基板、叠层芯片组装、板级叠层互连,实现了3D-MCM结构,制作出薄膜3D-MCM样品;探索出主要的工艺流程及关键工序控制方法,实现了薄膜3D-MCM封装。
3D-MCM technology based on MCM-D thin film technique was studied, including embedded passive components, chip thinning, stacked die package, low-profile gold wire bonding, chip hump and board-level stacked structure intercormection assembly. The stacked structure of 3D-MCM was obtained by using techniques such as embedded substrate, stacked die package and board-level stacked structure intercormection. 3D-MCM samples were prepared. Main process and control methods for key steps were developed. And finally, 3D-MCM packaging was implemented.
出处
《微电子学》
CAS
CSCD
北大核心
2010年第2期291-294,299,共5页
Microelectronics
关键词
3D-MCM
内埋置基板
叠层型结构
三维叠层互连
3D-MCM
Embedded substrate
Stacked structure
3-D stacked structure interconnection
作者简介
刘欣（1969-），男（汉族），重庆人，高级工程师，主要从事厚薄膜混合集成电路研究。
