摘要
采用无卤有机酸和有机胺作为活化剂,并添加复合型非离子表面活性剂,通过正交试验方法对助焊剂各主要成分及配比进行选择和优化设计,研制了一种具有优异助焊性能的无卤免清洗助焊剂。最佳配方为:复配活化剂含量为2.8%,助溶剂含量为18%,成膜剂、表面活性剂含量均为0.4%(均为质量分数)。依照国际电子行业标准对最优配方的助焊剂进行性能检测,结果表明:制备的液体助焊剂外观呈无色透明,无分层或晶体析出,稳定性好;焊后焊点光亮饱满、无需清洗,铺展面积大,扩展率达到91.45%,助焊性能较好。SEM分析结果表明,助焊剂的焊点可靠性较高,界面IMC层分布清晰且连接牢固。助焊剂中不含卤素,焊后残留较少,腐蚀性较弱。SIR分析结果显示,助焊剂的电气绝缘性能较好,梳形电极上无枝晶生长和变色,SIR值在1.0×10^(8)Ω以上。助焊剂相关性能指标均达到国际电子行业标准,能较好的满足Sn-Cu系无铅焊料的焊接需求。
Using halogen-free organic acids and organic amines as activators,and adding compound non-ionic surfactants,a halogen-free,no-clean flux with excellent soldering performance was developed through the orthogonal test design method to select and optimize the main components and ratios of flux.The optimum formula combination consists of a compound activator content of 2.8%,a solubilizer content of 18%,and a film-forming agent and surfactant content of 0.4%each(all in mass fractions).According to the international electronic industry standards,the comprehensive performance of the flux with the optimized formula was tested.The results showed that the prepared flux has a colorless and transparent appearance,with no lamination or crystallization,showing good stability.After the flux is welded,the solder joints exhibit bright and full appearence which requires no cleaning.The flux has a large spreading area with an expansion rate of 91.45%,indicating excellent welding performance.The results of SEM showed that the flux solder joint has high reliability,with a clear and firmly bonded distribution of the intermetallic compound(IMC)layer at the interface.The flux contains no halogen,less residual after welding and weaker corrosivity.The SIR analysis results showed that the flux displays good electrical insulation performance.There is no dendritic growth or discoloration observed on the comb-shaped electrodes,and the SIR value is above 1.0×10^(8)Ω,indicating excellent performance.The relevant performance indicators of the flux meet the international electronic industry standards,which maks it well-suited to meet the soldering requirements of Sn-Cu lead-free solder materials.
作者
李伟超
杨晨
王震东
王加俊
赵玲彦
LI Weichao;YANG Chen;WANG Zhendong;WANG Jiajun;ZHAO Lingyan(R&D Center of Yunnan Tin Group(Holding)Co.,Ltd.,Kunming 650101,China;School of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;School of Metallurgy and Energy Engineering,Kunming University of Science and Technology,Kunming 650093,China)
出处
《材料科学与工艺》
北大核心
2025年第1期89-96,共8页
Materials Science and Technology
基金
云南省企业基础研究应用基础研究联合专项(202101BC070001-017、202101BC070001-010)。
关键词
免清洗助焊剂
无卤
正交试验
助焊性能
无铅焊料
no-clean flux
halogen-free
orthogonal test
welding performance
lead-free solder
作者简介
李伟超(1994年-),男,硕士研究生;通信作者:赵玲彦,E-mail:zhaoly_ytc@163.com。
