摘要
微电子封装具有微型化、高密度、低成本和良好的电气性能的特点,焊点负责内部芯片与电路板间的电气和机械连接。由于生产设计过程中产生的缺陷或经受温度变化、振动和冲击等环境载荷,焊点易发生失效。本文总结了焊点常见的疲劳失效原因,X射线、染色分析等失效分析技术可以实现失效焊点的精准定位,便于分析失效原因。随后,总结了焊点疲劳寿命预测模型的应用和研究现状,比较了各模型优缺点及适用范围,可为微电子封装的可靠性分析与评估提供理论指导。
Microelectronic packaging technology has the characteristics of miniaturization,high density,low cost and good electrical performance.The solder joints are responsible for the electrical and mechanical connection between the microelectronic packaging device and the circuit board.The generated defects during manufacturing and experiment may lead to failure of solder joints.In this review,failure mechanisms are discussed.Failure detection technologies,such as X-ray and dyeing analysis,can accurately detect the position of failed solder joints.The application and research status of solder joints life prediction models were then summarized.The advantages,disadvantages and scope of application of these fatigue models are compared,which can provide theoretical guidance for the reliability of microelectronic packaging.
作者
黄姣英
曹阳
高成
HUANG Jiaoying;CAO Yang;GAO Cheng(School of Reliability and Systems Engineering,Beihang University,Beijing 100191,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2020年第10期11-16,24,共7页
Electronic Components And Materials
基金
装备预研基金资助(6140002010202)。
关键词
微电子封装
焊点
综述
疲劳失效
寿命预测模型
microelectronics packaging
solder joints
review
fatigue failure
life prediction model
作者简介
黄姣英(1977-),女,湖南邵阳人,高级工程师,主要从事元器件可靠性试验、分析与评价的研究;曹阳(1995-),女,河北唐山人,研究生,研究方向为元器件可靠性试验、分析与评价。
