摘要
针对I/F转换电路高温测试发现的零偏和线性度异常问题,在进行电路工作原理分析的基础上,重点开展了AD8638器件性能、模拟开关漏电、残留助焊剂、内部水汽、成膜基板以及引脚绝缘性等因素的影响分析,明确了故障现象是由于绝缘子表面涂层堆积在高温下绝缘电阻下降所致。故障电路相关引脚玻璃绝缘子表面出现涂层堆积,其在高温下涂层绝缘性能下降,是造成电路零偏和线性度异常的原因,且高温测试条件下绝缘电阻实测值与理论计算值吻合。当温度继续升高时,溶剂分子开始从涂层挥发,涂层绝缘性能和绝缘电阻逐渐提高,直至电路参数恢复正常。通过开展823涂层对电参数影响试验研究,得到了电路失效的内在机理,确定了产品处置措施和后续改进措施。
Based on the analysis of the working principle of the circuit,we focused on the impact analysis of AD8638 device performance,simulated switch leakage,residual flux,internal water vapor,film-forming substrate,and pin insulation on the problems of zero bias and linearity anomalies discovered during high-temperature testing of I/F conversion circuits,finally,clarified that the fault phenomenon was caused by the deposition of insulation resistance on the surface coating of the insulator at high temperature.The surface of relevant pins glass insulators of faulty circuit occurred coating accumulation,and the insulation performance of the coating decreased at high temperature,which was the reason of causing circuit zero bias and linearity anomalies,and the insulation resistance measured values were identical with theoretical calculating values at high temperature test conditions.When the temperature continued to rise,the solvent molecules began to volatilize from the coatings,and the insulation performance and insulation resistance of the coating increased gradually until the circuit parameters returned to normal.By conducting experimental research on the influence of 823 coating on electrical parameters,the inherent mechanism of circuit failure was obtained,and product disposal measures and subsequent improvement measures were determined.
作者
夏俊生
肖雷
臧子昂
李建和
李寿胜
杜松
尹宏程
XIA Junsheng;XIAO Lei;ZANG Ziang;LI Jianhe;LI Shousheng;DU Song;YIN Hongcheng(China Ordnance Industry 214 Research Institute,Bengbu 233030,China)
出处
《新技术新工艺》
2024年第9期75-80,共6页
New Technology & New Process
关键词
零偏和线性度异常
高温测试
823涂层
玻璃绝缘子
绝缘电阻
机理分析
zero bias and linearity abnormity
high temperature testing
823 coating
glass insulators
insulation resistance
mechanism analysis
作者简介
夏俊生(1970-),男,研究员,主要从事混合集成电路与SiP封装、工艺技术、可靠性等方面的研究。
