摘要
[目的]开发了以氧化亚铜和氯化亚锡为主盐的无氰电镀铜−锡(Cu–Sn)合金体系。[方法]通过阴极极化曲线测试,研究了体系中亚锡离子和亚铜离子的电化学还原行为,并通过霍尔槽试验、扫描电子显微镜和能谱仪考察了镀液组成和电流密度对Cu–Sn合金镀层外观、形貌和元素组成的影响。[结果]在无氰亚铜电镀Cu–Sn合金体系中,亚铜离子的还原电位比亚锡离子的还原电位更负,且锡的电沉积更容易受到传质过程控制。当镀液中含有硫脲(作为亚铜离子配位剂)80 g/L、氧化亚铜16 g/L、酒石酸钾钠(作为锡离子配位剂)20 g/L及无水氯化亚锡8 g/L时,高电流密度和低电流密度下所得的Cu–Sn合金镀层都呈均匀的银灰色,结晶细致,并且Sn的质量分数稳定在35%左右。[结论]采用无氰亚铜体系可以电镀得到成分可控的Cu–Sn合金镀层。
[Objective]A cyanide-free bath using cuprous oxide and stannous chloride as the main salts for copper-tin(Cu-Sn)alloy electroplating was developed.[Method]The electrochemical reduction behaviors of stannous ions and cuprous ions in the bath were studied by cathodic polarization curve measurement.The effects of bath composition and current density on the appearance,morphology,and elemental composition of Cu-Sn alloy coating were examined by Hull cell test,scanning electron microscopy(SEM),and energy-dispersive spectroscopy(EDS).[Result]In the cyanide-free cuprous Cu-Sn alloy electroplating bath,the reduction potential of cuprous ions was more negative than that of stannous ions,and the electrodeposition of tin was more easily controlled by the mass transfer process.The Cu-Sn alloy coatings electroplated in the bath composed of 80 g/L thiourea(as a complexing agent for cuprous ions),16 g/L cuprous oxide,20 g/L potassium sodium tartrate(as a complexing agent for tin ions),and 8 g/L anhydrous stannous chloride at both high and low current densities featured a uniform silver-gray appearance,fine crystallization,and a stable tin mass fraction of around 35%.[Conclusion]Cu-Sn alloy coatings with controlled compositions can be electroplated from a cyanide-free cuprous bath.
作者
邢希瑞
刘颖
王亚伟
赵万成
夏方诠
田栋
李宁
XING Xirui;LIU Ying;WANG Yawei;ZHAO Wancheng;XIA Fangquan;TIAN Dong;LI Ning(Shandong Luqiao Group Co.,Ltd.,Ji’nan 250014,China;Shenyang Bestfly Technic Co.,Ltd.,Shenyang 110141,China;School of Chemistry and Chemical Engineering,University of Jinan,Ji’nan 250022,China;School of Chemistry and Chemical Engineering,Harbin Institute of Technology,Harbin 150001,China)
出处
《电镀与涂饰》
北大核心
2025年第1期62-68,共7页
Electroplating & Finishing
关键词
无氰电镀
铜–锡合金
亚铜离子
硫脲
锡含量
霍尔槽试验
cyanide-free electroplating
copper–tin alloy
cuprous ion
thiourea
tin content
Hull cell test
作者简介
第一作者:邢希瑞(1986-),男,高级工程师,研究方向为表面处理;通信作者:刘颖(1986-),男,硕士,高级工程师,研究方向为表面处理;通信作者:田栋(1984-),男,博士,讲师,研究方向为表面处理。
