摘要
电镀铜锡合金具有装饰性好、可焊性优良、成本低、无毒、不使人体过敏等优点,而得到广泛的应用。介绍了电镀铜锡合金工艺的研究进展和应用、电镀铜锡合金镀液配方和工艺条件。
Electroplated Cu-Sn alloy coating is good in decoration and solderability, low in cost, non-toxic, not irritable, etc., and has been widely used. The research progresses and applications of Cu-Sn alloy plating process are presented, and the bath formulations and operational conditions of Cu-Sn alloy plating process are also introduced.
出处
《电镀与环保》
CAS
CSCD
2007年第4期1-3,共3页
Electroplating & Pollution Control
基金
云南省自然科学基金项目2005E0030M
关键词
铜锡合金
电镀
进展
Cu-Sn alloy
electroplating
advance
