摘要
采用直接混合加热法制备氮化物陶瓷复合导热填料,这是一种可以批量生产,并且不使用溶剂、对环境友好的制备方法。通过扫描电镜、X射线衍射仪、TCI导热仪研究不同金属纳米粒子(镍、钴和银)在氮化物(氮化铝、氮化硼)上的负载情况以及负载量,并考察了复合陶瓷导热填料对聚乙烯醇基复合导热膜导热性能的影响。结果表明,金属纳米粒子成功负载到氮化物上而不改变氮化物的晶体结构。且负载金属粒子的尺寸随乙酸盐含量的增加而增大。另外,负载金属粒子的陶瓷导热填料能有效提高聚乙烯醇基复合导热膜导热能力,Ag/AlN-0.05导热膜的导热率能达到0.752 W/(m·K)。
Nitride thermal conductive composite fillers were prepared by the mix and heat method.It’s an environmentally friendly preparation method that can be mass-produced and does not use solvents.The loading of different metal nanoparticles(nickel,cobalt and silver)onto nitrides(aluminum nitride,boron nitride)and the amount of loading were investigated by scanning electron microscopy,X-ray diffractometer and TCI thermal conductivity meter,and the effect of composite ceramic thermally conductive filler on the thermal conductivity of polyvinyl alcohol-based composite thermal conductive film was examined.The results show that the metal nanoparticles were successfully loaded onto the nitrides without changing the crystal structure of the nitrides.And the size of the loaded metal particles increase with the increase of acetate content.In addition,the ceramic thermally conductive filler loaded with metal particles can effectively improve the thermal conductivity of polyvinyl alcohol-based composite thermally conductive film,and the thermal conductivity of Ag/AlN-0.05 thermally conductive film can reach 0.752 W/(m·K).
作者
陈燕杰
董华蕊
马清怡
赵雪伶
陈立飞
CHEN Yanjie;DONG Huarui;MA Qingyi;ZHAO Xueling;CHEN Lifei(School of Energy and Material,Shanghai Polytechnic University,Shanghai 201209,China;School of Resources and Environmental Engineering,Shanghai Polytechnic University,Shanghai 201209,China;Shanghai Engineering Research Center of Advanced Thermal Functional Materials,Shanghai Polytechnic University,Shanghai 201209,China)
出处
《上海第二工业大学学报》
2024年第1期9-18,共10页
Journal of Shanghai Polytechnic University
关键词
氮化铝
氮化硼
乙酸盐
金属粒子
导热填料
aluminum nitride
boron nitride
acetate
metal particles
thermal conductive fillers
作者简介
通信作者:陈立飞(1973–),女,辽宁锦州人,教授,博士,主要研究方向为微纳尺度传热及热功能材料。E-mail:lfchen@sspu.edu.cn。
