摘要
环氧树脂具有质量较轻、防腐性能和绝缘性能优良等一系列优势,因而被广泛应用于电气装备、高电压绝缘系统和航空航天等诸多领域。但环氧树脂的本征热导率较低,约为0.11~0.19 W/(m·K),如此低的热导率不利于系统及时有效地散热。氮化硼纳米片(BNNS)由于其优良的导热性能和绝缘性能,在高电压绝缘系统中具有广阔的应用前景。然而,BNNS制备流程复杂以及在液体中分散性差是目前限制其广泛应用的主要原因。采用一种简单而有效的蔗糖辅助机械化学剥离(SAMCE)方法来同时实现BNNS的剥离和改性,将蔗糖剥离改性得到的六方氮化硼(h-BN)加入环氧树脂中,添加改性h-BN的质量分数为15%时,复合材料的热导率可以达到0.51 W/(m·K),此时复合材料的热导率是纯环氧树脂材料的3.2倍,导热性能明显提升。为解释改性h-BN提升环氧树脂复合材料导热性能的机理,根据有效介质近似(EMA)理论模型反推计算得到改性前后h-BN/环氧树脂复合材料中填料颗粒与基质之间的界面热阻值,计算得到h-BN/环氧树脂复合材料的界面热阻为2.44×10^(-6)m^(2)·K/W,改性h-BN/环氧树脂复合材料的界面热阻为4.73×10^(-7)m^(2)·K/W,改性后的h-BN/环氧树脂复合材料的界面热阻值约为改性前的1/5。
Epoxy resin has a series of advantages such as light weight,excellent anti-corrosion performance and excellent insulation performance,so it is widely used in many fields such as electrical equipment,high-voltage insulation system and aerospace.However,the intrinsic thermal conductivity of epoxy resin is low,about 0.11—0.19 W/(m·K).Such a low thermal conductivity is not conducive to the timely and effective heat dissipation of the system.Boron nitride nanosheets(BNNS)have broad application prospects in high-voltage insulation systems due to their excellent thermal conductivity and insulation properties.However,the complex preparation process and poor dispersibility of BNNS in liquids are currently the main factors that limit their wide application.A simple and effective sucrose-assisted mechanochemical peeling(SAMCE)method was used to realize the peeling and modification of BNNS at the same time.The h-BN obtained by the sucrose peeling modification was added to the epoxy resin.When the mass fraction of modified h-BN was 15%,the thermal conductivity of the composite material could reach 0.51 W/(m·K).At this time,the thermal conductivity of the composite material was 3.2 times that of the pure epoxy resin material,and the thermal conductivity was significantly improved.In order to explain the mechanism of modified h-BN to improve the thermal conductivity of epoxy resin composites,the interface thermal resistance between filler particles and matrix in the h-BN/epoxy composite before and after the modification was calculated based on the effective medium approximation(EMA)theoretical model.The calculated interface thermal resistance of the h-BN/epoxy resin composite material was 2.44×10^(-6)m^(2)·K/W,and the interface thermal resistance of the modified h-BN/epoxy resin composite material was 4.73×10^(-7)m^(2)·K/W,the interface thermal resistance of the modified h-BN/epoxy resin composite was about 1/5 of that before modification.
作者
杨薛明
胡宗杰
王炜晨
刘强
王帅
YANG Xueming;HU Zongjie;WANG Weichen;LIU Qiang;WANG Shuai(School of Power Engineering,University of North China Electric Power,Baoding 071003,Hebei,China;Hebei Province Key Laboratory of Low-carbon High-efficiency Power Generation Technology,Baoding 071003,Hebei,China)
出处
《材料导报》
EI
CAS
CSCD
北大核心
2023年第2期186-191,共6页
Materials Reports
基金
国家自然科学基金(52076080)。
关键词
氮化硼
环氧树脂
界面热阻
蔗糖改性
热物性
boron nitride
epoxy resin
interface thermal resistance
sucrose modification
thermophysical property
作者简介
通信作者:杨薛明,教授,博士研究生导师。1993年获得华北电力大学工学学士学位,1996年获得华北电力大学工学硕士学位,2007年获得华北电力大学工学博士学位,2009年留学美国匹兹堡大学从事博士后研究,2014年在清华大学航天航空学院从事博士后研究,现从事微纳尺度传热传质、复合材料热物性相关研究。共发表论文60余篇,其中SCI收录30余篇。xuemingyang@ncepu.edu.cn.
