美国对华半导体产业链竞争:东亚地区的视角被引量：20

The United States'Competition with China on Semiconductor Industry Chain:A Perspective of East Asia

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摘要基于对美国及东亚地区半导体产业链发展态势的判断,拜登政府积极拉拢韩国、日本以及中国台湾地区组建“半导体联盟”,加强对华半导体产业链竞争。美国此举主要出于三重动因:维护美国主导下的等级制半导体产业链体系,遏阻中国向产业链高端延伸;借机汲取东亚地区优势资源,增强美国半导体供应链韧性和产业霸权;收拢针对中国半导体产业的围堵网。为此,美国重视“相对收益”,一面要求东亚地区盟友及伙伴配合美国围堵中国,另一面要求其提交半导体生产数据,向美国转移先进产能及技术,并与美国开展联合技术研发。而韩国、日本以及中国台湾地区均从自身利益出发,对美国“半导体联盟”做出有所保留的政策回应,利益分歧势必制约美国对华半导体产业链战略布局的发展前景。为应对半导体产业链竞争,中国应当加强政治层面的对外战略沟通,更需要锤炼内功,畅通国内国际双循环,优化半导体融资及人才机制,明确政府、高校、科研机构及企业在国家科技创新体系中的定位与分工,从根本上增强半导体产业链韧性和竞争力。 Based on the assessment of the development of the semiconductor industry chain in the U.S.and East Asia,the Biden Administration has persuaded South Korea,Japan,and Taiwan of China to join the semiconductor coalition,escalating the competition with China in semiconductor industry chain.The U.S.has three motives:firstly,maintaining the U.S.-dominated hierarchical semiconductor industry chain and curbing China's upgrading to the high end of the industrial chain;secondly,drawing on the superior resources of East Asia to enhance the supply chain resilience and semiconductor industrial hegemony of the U.S.;lastly,reeling in the containment net surrounding China's semiconductor industry.Urging its allies and partners in East Asia to cooperate to contain China,the U.S.has required them to submit production data,transfer advanced capacity and technology to the U.S.,and carry out joint R&D.However,South Korea,Japan,and Taiwan of China,having their own interests to pursue,haven't wholeheartedly supported the U.S.-led coalition.The divergent interests will inevitably restrict the prospect of U.S.semiconductor industry chain competition with China.To cope with the challenges,China should strengthen strategic dialogues at the political level.And more importantly,China needs to fundamentally reinforce the resilience and competitiveness of its semiconductor industry by expediting the dual circulations,optimizing the finance and talent mechanism,and clarifying the specialization of multiply entities,including government,universities,scientific institutions and enterprises,in the national innovation system.

作者李金锋 LI Jinfeng

机构地区南京大学国际关系学院南京大学亚太发展研究中心

出处《外交评论（外交学院学报）》 CSSCI 北大核心 2023年第3期51-77,I0002,I0003,共29页 Foreign Affairs Review

基金 2021年江苏省研究生科研创新计划“美日半导体贸易争端的政治解决过程研究(1985-1992)”(项目编号:KYCX21_0006)的阶段性成果。

关键词拜登政府半导体产业链东亚地区半导体联盟中美关系 Biden administration semiconductor industry chain East Asia semiconductor coalition Sino-US Relations

分类号 F416.63 [经济管理—产业经济]

作者简介李金锋,南京大学国际关系学院博士生、南京大学亚太发展研究中心研究助理(南京210023)。