摘要
漏镀是化镍金(Electroless Nickel and Immersion Gold, ENIG)产线上常见的一种品质问题,经常出现在焊盘、标志(Mark)点、印制插头等部位。导致漏镀的原因主要有铜面污染、药水影响以及板件本身问题这几种。我们发现一种连接掩埋大铜面的小焊盘容易出现漏镀,业界关于这种情况的漏镀如何改善研究较少。文章通过设计实验分析了该漏镀主要是由电势差引起铜面钯吸附量不足所导致的,并提出了相应的改善措施供大家参考。
Skipping plating is a common quality problem on the Electroless Nickel and Immersion Gold(ENIG)production line,which often occurs in pads,mark points,printed plugs and other parts.The main causes of skipping plating are copper surface pollution,the influence of solution and the problems of the plate itself.The author found that a kind of small pad connecting the burying large copper surface is prone to skipping plating,and there are few studies on how to solve this problem in the industry.In this paper,through the design experiment,it analyzed the skipping plating problem which is mainly caused by the insufficient palladium adsorption on the copper surface caused by the potential difference,and the corresponding improvement measures are put forward for reference.
作者
黎小芳
黄憬韬
王倩玉
黄辉祥
李小兵
Li Xiaofang;Huang Jingtao;Wang Qianyu;Huang Huixiang;Li Xiaobing
出处
《印制电路信息》
2022年第2期25-28,共4页
Printed Circuit Information
关键词
化镍金
小焊盘
漏镀
钯吸附量
表面张力
Electroless Nickel/Immersion Gold
Small PAD
Skipping Plating
Palladium Adsorption Capacity
Surface Tension
作者简介
第一作者:黎小芳,硕士,高级技术开发工程师,主要负责PCB表面处理药水的研发工作。
