摘要
在简单介绍印制板化学镀镍金工艺原理的基础上 ,对化学镀镍金之工艺流程、工艺控制。
The technology of Ni/Au plating of the printed circuit board was briefly introduced. The process, technology control, solderability control and the defectiveness genesis analysis of Ni/Au plating were also illuminated.
出处
《电子工程师》
2001年第12期55-58,共4页
Electronic Engineer
