摘要
采用计算机采样等实验手段，研究了外电场在诱发非催化活性金属铜表面产生化学镀镍过程中的作用。研究结果表明，当铜基体电位等于或低于临界诱发电位时才有可能引发化学镀自催化沉积。试样的表面状况、溶液条件和通电电流密度都对临界诱发时间有影响。铜基体达到临界诱发电位－０．５２０Ｖ（ｖｓＳＣＥ）和临界诱发时间是引发化学镀镍成功的必要和充分条件。计算表明，新生的镍原子如果以单原子层覆盖铜表面。
The induction of electroless Ni P deposition on copper substrate by virtue of the external direct electric field was investigated. The data acquisition was carried out by microcomputer. The experimental results indicate that: (1) The potential of copper substrate has to be equal to or more negative than the critical induction potential -0.520 V(vs SCE), otherwise the deposition of electroless nickel would not occur; (2) The critical induction time depends on the surface state of the sample, the solution and the current density; (3) Surface coverage of 12% is enough for the substantial initiation of the electroless deposition, if the newborn nickel atoms are deposited in the form of monolayer.
出处
《中国有色金属学报》
EI
CAS
CSCD
1996年第4期33-36,共4页
The Chinese Journal of Nonferrous Metals
基金
国家自然科学基金
关键词
电场诱发
化学镀镍
诱发过程
外电场
electric field electroless nickel plating induction process
