摘要
采用脉冲电镀法在紫铜和钢制试样上制备镀镍层。用ＳＥＭ和Ｘ衍射仪观察和研究了脉冲电镀镍层的表面形貌微观结构，测试了镀层硬度，测量了试样在７ｍｏｌ／Ｌ ＨＮＯ３溶液中的耐蚀性。用滤纸法和挠度弯曲法测试了镀层的孔隙率和内应力。研究结果表明，脉冲电镀镍层与直流镀镍层相比，结晶细密，孔隙率低，内应力和硬度提高，这主要是存在［２００］晶面择优取向的结果。
The nickel coating has been prepared on copper and steel sample by pulse plating, and surface morphology and microstructure were studied by SEM and XRD. Compared with direct current plated copper coating, the pulse plated coating was more compact in structure with [200] preferred orientation, and their properties were obviously superior to that of DC plated coating. The relationship between deposit structure and properties was discussed.
出处
《材料保护》
CAS
CSCD
北大核心
2001年第1期10-11,共2页
Materials Protection
