摘要
采用脉冲电镀法在碳纤维表面镀铜,研究了硫酸铜、硫酸、添加剂、施镀时间、电流密度、占空比等因素的影响,确定了合适的镀液成分和电镀工艺.采用冷热循环法检测镀层与碳纤维的结合力,采用SEM和XRD考察了铜镀层质量.结果表明,以130g/LCuSO4·5H2O,g/LH2SO450,30g/LKNO3及6mL/L光亮剂为镀液、室温下电流密度82μA/mm2、占空比40%、施镀时间6min为电镀条件,可在碳纤维表面得到表面平整细致、结晶度良好的铜镀层.镀层结合力由原来的270kPa提高到450kPa.
Pulse copper plating was used to coat a copper film on the carbon fiber surface. The effects of CuSO4, H25O4, additives, electroplating time, current density, and duty cycle on the weight gain rate were investigated. And the solution composition and technical parameters for pulse copper plating were determined. The bonding force between the coating and the carbon fiber was tested by psychro-thermal cycles. The quality of copper coating was examined with SEM and XRD. The composition of electroplating solution was 130 g/L CuSO4·5H2O, 50 g/L H2SO4, 30 g/L KNO3 and 6 mL/L brightener. Under ambient temperature, the optimum technical parameters were 82 μA/mm2 of current density, 40% of duty cycle, 6 rain of electroplating time, with the conditions a flat, detailed and well-crystalloid coating on the carbon fiber surface was achieved. Coating adhesion was increased from 270 kPa to 450 kPa.
出处
《过程工程学报》
CAS
CSCD
北大核心
2011年第4期716-720,共5页
The Chinese Journal of Process Engineering
关键词
碳纤维
单脉冲电镀
铜镀层
增重率
极化曲线
carbon fiber
single pulse plating
copper coming
weight gain rate
polarization curve
作者简介
高嵩（1963-），男，辽宁省沈阳市人，博士，教授，主要从事电化学分析方面研究和复合材料的制备，E-mail：songgao1963@163.com
