摘要
在前期研究的基础上，在Cu2P207.4H2020g／L、Sn2P2071g／L、K2HP04。3H2060g／L、pH=8．5、滚筒转速15r／min、滚镀时间1h、采用循环过滤的工艺条件下，通过正交试验研究了焦磷酸钾质量浓度、电流、温度和添加剂JZ-1的用量对低碳钢上无氰滚镀铜锡合金（低锡）镀层厚度和含锡量的影响，确定了最优的工艺条件，并探讨了滚镀电流、温度和时间对铜锡合金镀层的组成与镀速的影响。试验证明，当K4P207为300～350g/L、添加剂JZ-1为0．5mL／L、镀液温度为30～35℃、电流春度为0．38～0．48A／dm2时，可获得厚度5gm以上、锡含量为9％～11％的铜锡合金镀层，其外观光亮、金黄，与钢铁基体的结合力良好，具有一定的硬度与耐腐蚀性能，可以替代钢铁基材预镀镍和氰化预镀铜工艺。
Based on the previous works, the effects of mass concentration of potassium pyrophosphate, current, temperature, and dosage of JZ-1 additive on thickness and tin content of the cyanide-free barrel plated Cu-Sn alloy coating on low carbon steel substrate were studied by orthogonal test under the following conditions： CUEPEO7.4H20 20 g/L, SnEP2071 g/L, K2HPO4.3H20 60 g/L, pH 8.5, barrel rotation speed 15 r/min, plating time 1 h, and cycle filtration required. The optimal process conditions were determined, and the effects of plating current, temperature, and time on the composition and deposition rate of Cu-Sn coating were discussed. It is proved that a Cu-Sn alloy coating with at least 5 ~tm thickness and 9%-11% tin can be obtained with K4PzO7 300-350 g/L and JZ-1 additive 0.5 mL/L at temperature 30-35 ℃ and current density 0.38-0.48 A/dm2. The low-tin Cu-Sn alloy coating features a bright and golden appearance, good adhesion to the substrate, and favorable hardness and corrosion resistance, which is an alternative tonickel pre-plating and cyanide copper pre-plating on iron and steel substrates.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2012年第10期15-18,共4页
Electroplating & Finishing
关键词
钢铁基体
铜—锡合金
无氰滚镀
焦磷酸盐
镀速
iron and steel substrate
copper-tin alloy
cyanide-free barrel plating
pyrophosphate
deposition rate
作者简介
冯冰（1987-），男，河南长葛人，在读硕士研究生，主要研究方向为应用电化学。
通信作者 曾振欧，教授，（E-mail）zhouzeng@scut．edu．cn。
