摘要
研究电流密度对铜锡合金镀层致密性、硬度及耐蚀性能的影响。试验结果表明,在1.0 A/dm^2电流密度下得到的铜锡合金镀层具有良好的致密性和耐蚀性。
The effect of current density on the compactness, hardness and corrosion resistance of Cu-Sn alloy plating. The experimental results show the Cu-Sn alloy plating obtained under the current density of 1. 0 A/dm2 has better compactness and corrosion resistance.
出处
《有色金属加工》
CAS
2007年第4期39-41,共3页
Nonferrous Metals Processing
关键词
电流密度
铜锡合金镀层
致密形
耐蚀性
current density
Cu-Sn plating
compactness
corrosion resistance
