摘要
随着无铅化进程的逐渐深入,针对无铅焊点的长期可靠性,业界已经做了大量研究,但是试验参数的选取一直也是业界比较有争议的问题,其关注点也是基于失效机理和失效模式的考虑。文中主要从金相和断口的角度出发,对温度循环焊点的失效特征进行了总结,指导后续可靠性试验及失效分析的开展。
With the development of lead-free process, the long - term reliability of the lead-free soldered joints has been studied a lot in industry, but the selection of experimental parameters is a controversial issue, which mainly focus on the failure mechanism and failure mode. In this paper, from the view of the microstructure and the fracture point, the failure of the soldered joints through the thermal cycles was summarized, which can guide the following reliability test and failure analysis.
出处
《焊接》
北大核心
2010年第8期41-44,共4页
Welding & Joining
基金
国家自然科学基金重点项目(U0734006)
广东省科技计划项目(2008A080403008)
关键词
无铅
BGA
温度循环
失效
lead-free
BGA
temperature cycling
failure
作者简介
王鹏程，1981年出生，硕士，工程师。主要从事无铅焊接技术研究。
