摘要
集成电路的轻量化和高密度化已成为未来发展趋势,在此背景下,作为芯片防护层的塑封材料的可靠性愈发重要。但是塑封体与芯片之间常出现界面分离从而形成分层,造成器件失效,所以有必要对封装整体进行热机械设计。但在封装体的可靠性验证方面,如进行实验验证则需要真实的器件,具有很高的试验成本,而通过有限元仿真的方法即可高效地解决。因此以常规TO型封装为研究对象,通过仿真对具有不同特性参数的封装体进行热应力分析探究,以最大热应力等效衡量器件分层程度,揭示环氧塑封料影响器件可靠性的主要因素,总结失效规律并确定失效原理,为后期应用端作出风险预测并提出改进方案。
Lightweight and high density has become the future trend of integrated circuits.In this context,the reliability of the molding material as the protective layer of the chip is becoming more and more important.However,the interface between the encapsulant and the chip is often separated to form a delamination,resulting in device failure.Therefore,it is necessary to carry out thermo-mechanical design of the package body.However,in terms of reliability verification,experimental verification requires the use of real devices,which has a high test cost.The method of finite element simulation can be solved efficiently.Therefore,in this paper,we take the conventional TO-type package as the research object,and investigate the thermal stress analysis of plastic-encapsulated devices with different characteristic parameters through simulation.The maximum equivalent stress is used to measure the degree of device delamination,revealing the main factors affecting the reliability of the product package.Summarize the failure rule and determine the failure principle,make risk prediction for the later application and put forward the improvement plan.
作者
邵志峰
邹洪生
邱松
邹振兴
于兆鹏
李进
SHAO Zhifeng;ZOU Hongsheng;QIU Song;ZOU Zhenxing;YU Zhaopeng;LI Jin(China Resources Microelectronics Co.,Ltd.,Wuxi 214061,China;Eterkon Semiconductor Materials Co.,Ltd.,Kunshan 215301,China)
出处
《电子工业专用设备》
2025年第4期15-23,32,共10页
Equipment for Electronic Products Manufacturing
关键词
环氧塑封料
热应力
分层失效
有限元仿真
封装结构
Epoxy molding compound
Thermal stress
Delamination failure
Finite element simulation
Packaging structure
作者简介
邵志峰(1982-),男,硕士,工程师。研究方向:SiC功率模块封装;于兆鹏(1998-),男,硕士,工程师。研究方向:环氧模塑料的研究与开发。
