摘要
3G时代的到来,对现在的产品使用的材料是一个挑战。随着产品的传输频率越来越高,传输速度也越来越快,趋肤效应越来越明显。铜箔的毛面和光面的粗糙度成为影响信号完整性一个关键因素,本次试验的目的就是从理论设计出发,选择不同介质损耗的板材,配合不同粗糙度的铜箔和不同内层表面处理方式,根据终端信号的模拟,找到介质损耗和铜箔粗糙度对信号传输的影响,为后续终端设计师对板材和铜箔的选择做好理论和实践准备。
As the age of 3G coming,it will be a challenge for the μrgent materials.The freqμency of the signal is higher and higher,the skin effect will be more obvioμs.The copper profile will be one of the key effect to the signal integrity.The experiment μse two kind materials of SYSY(High Tg and Low Dk and Low Df) with different kinds of copper foil then select the infect of the Copper Profile according to the analog signal,and it will be more helpfμl for the stylist to select more appropriate material.
出处
《印制电路信息》
2010年第S1期512-523,共12页
Printed Circuit Information
关键词
介质损耗
铜箔粗糙度
趋肤效应
信号完整性
插损
Loss Tangent
Copper Profile
Skin Effect
Signal Integrity
Insertion loss
