摘要
文章涉及的是用于通讯网络设备领域的FR-4材料,而不涉及一些用于射频领域的陶瓷基或聚四氟乙烯一类的材料。通讯网络系统正向着越来越高速的方向发展,目前已经有25Gbps的背板系统以及28Gbps的线卡需求。随着通讯网络系统的高速趋势,通讯网络设备公司对PCB材料的Dk/Df值及铜箔粗糙度(电性能)提出了越来越高的要求,以达到减少插损的目的。同时,为了提高产品的价格竞争优势,对于材料的成本控制也有越来越多的考虑。基于我们在设计过程中的PCB材料选择经验,这里主要探讨在PCB设计过程中,如何选择出既能满足产品信号完整性需求又具备成本优势的PCB材料。
In this paper, the discussion is about materials used in digital product in telecommunications field, excluding some materials with ceramic base or PTFE used on Radio Frequency. In Telecommunications field, there have been 25 Gbps backplane system and 28 Gbps run on a line card. Driven by high speed system, PCB design houses have higher and higher requirement to material Dk/Df and copper roughness so as to achieve minimized insertion loss. Meanwhile, material cost has been more considered to improve competitive advantage from product price. Based on our company material selection experience, here we discuss on how to select PCB material during designing process, which can have both good enough performance to meet product signal integrity and effective cost.
出处
《印制电路信息》
2015年第3期9-16,共8页
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