摘要
通过试验研究了聚合物微流控芯片微通道模压的工艺过程和工艺参数(包括模压温度、模压压力、模压时间、不同材料及卸载温度等)对微通道尺寸的影响。建立了模压工艺参数与微通道尺寸的关系,并基于黏弹性模型利用有限元方法进行了模压过程的数值仿真,仿真结果与试验结果基本吻合。本文的研究结果对完善聚合物微流控芯片设计和制作的基本理论和基本技术具有积极意义。
A polymer micro hot embossing process was characterized by the experiments and numerical simulations. A series of experiments were carried out with varied process conditions, including processing pressure, temperature, time, different materials and unload temperature, both the depth and width of hot-embossed microchannel was investigated. Furthermore, the hot-embossing process was numerically simulated by the finite element method using a viscoelastic model to understand its mechanism. The simulation results show in satisfactory agreement with the related experiments, being significant for improvement of the basic theories and the practical techniques of the structure design and manufacture of the polymer microfluidic chips.
出处
《吉林大学学报（工学版）》
EI
CAS
CSCD
北大核心
2006年第5期696-700,共5页
Journal of Jilin University:Engineering and Technology Edition
基金
国家自然科学基金资助项目(10572053)
高等学校博士学科点专项基金资助项目(20040183057)
吉林省科技发展计划项目(20020610)
关键词
仪器仪表技术
电泳芯片
微流控芯片
生物芯片
微全分析系统
微机电系统
数值仿真
热模压
technology of instrument and meter
capillary electrophoresis chip
microfluidic chip
biochip
μ-TAS
MEMS
numerical simulation
hot embossing
作者简介
文伟力（1975-），男，博士研究生．研究方向：MEMS系统设计、仿真、制作及图像处理，模式识别．E—mail：whpmr@163．com
通讯联系人：于建群（1958-），男，教授，博士生导师．研究方向：数字化设计与制造，基于MEMS技术的微流控分析系统．E-mail：yujianqun@jlu．edu．cn
