摘要
享有“黄金塑料”之称的热塑性聚酰亚胺(Thermoplastic polyimide/TPI),因其优异的抗腐蚀性,抗疲劳,耐磨损,使用寿命长等优点,在汽车,机械,电子行业得到广泛的应用。近年来,为了解决刚挠结合板后开盖镭射成本,前开盖表面铜皮破损等问题,TPI材料替代覆盖膜(Cover Film/CVL)在印制电路板(Printed-circuit Board/PCB)行业的应用受到了广泛的关注。然而,TPI材料的粘性特性,使得应用TPI材料板件的加工工艺与CVL有较大差异。其中,TPI与半固化片(Prepreg/PP),分属不同的材料体系,其Tg点,层压时固化所需温度,时间均有较大差异,如何通过设计层压参数,满足层压后两者结合力及成品可靠性,成为TPI材料产品加工及应用难点。文章以四层板刚挠结合板为例,通过改变层压升温速率,层压压力,调节TPI材料在粘度最低点的动态粘度,增加TPI材料粘流态下流动性能,从而增大了TPI与PP两者分子间扩散,提升了层压后TPI与PP的结合力;并通过剥离强度测试,验证了实验方案的可行性。文章通过探究不同层压参数作用下TPI与PP结合力,不仅为TPI材料刚挠结合板开发应用作参考,同时也对不同体系,不同Tg点的材料层压失效分析及改善,具有重要的指导意义。
Thermoplastic polyimide(TPI),known as"gold plastic",is widely applied in automotive,mechanical,and electronic industries because of its excellent corrosion resistance,fatigue resistance,wear resistance,long service life,and other advantages.In recent years,the application of TPI material replaces Covering Film(CVL)in the Printed circuit Board(PCB)industry has attracted wide attention to solve the problems of laser cost and damaged copper skin on the Front Cover of the RigidFlex PCB.However,due to the viscosity of TPI materials,the processing technology of TPI materials is quite different from CVL.Among them,TPI and Prepreg(PP)belong to different material systems,and their Tg points,temperature,and time required for curing during lamination are quite different.How to design lamination parameters to meet the binding force and reliability of finished products after lamination has become a difficulty in the processing and application of TPI material products.In this paper,it took a four-layer Rigid-Flex PCB as an example,by changing the laminating heating rate,laminating pressure,and other means,adjusting the dynamic viscosity of TPI material at the lowest point of viscosity,increasing the flow performance of TPI material under viscous flow state,thus increasing the intermolecular diffusion between TPI and PP,and improving the binding force of TPI and PP after laminating.The feasibility of the experimental scheme was verified by the peel strength test.By exploring the binding force between TPI and PP under different lamination parameters,this paper not only provides a reference for the development and application of Rigid-Flex PCB with TPI material but also has important guiding significance for the failure analysis and improvement of material lamination with different systems and Tg points.
作者
集博腾
孙东城
唐昌胜
Ji Boteng;Sun Dongcheng;Tang Changsheng
出处
《印制电路信息》
2022年第S01期142-151,共10页
Printed Circuit Information
关键词
TPI材料
层压
结合力
升温速率
压力
动态粘度
TPI Materials
Lamination
Bonding
Heating Rate
Pressure
Dynamic Viscosity
作者简介
第一作者:集博腾,无锡深南电路有限公司,产品研发工程师。
