摘要
随着5G技术的不断成熟,电子产品逐步趋向于密度高、线路密、重量轻、体积小。为了满足电子产品高密轻薄的特点,使用任意层互联技术或跨层盲孔技术可有效提高印制电路板的集成度,但由于任意互联技术存在对位系统难、流程周期长等缺点,跨层盲孔技术能有效解决该问题。在刚挠印制电路板中,加工跨层盲孔需要激光烧穿多种不同的介层材料(例如:半固化片(PP)、聚酰亚胺(PI)和覆盖膜(CVL))。由于不同的材料在不同的波长下有不同的吸收率(详见图1),当使用同一种激光加工方式时,孔型的管控难度大大提高。文章通过不同工艺,可以实现0.1 mm孔径的跨层盲孔,可应用在多种叠层结构中,解决了叠盲孔对位偏差的问题,缩短了加工周期,同时大大提高了电子产品的集成度。
As 5G technology continues to mature,electronics products gradually tend to high density,light weight,small size.In order to achieve the high density,light-weight and thin characteristics of electronic products the application of any layer interconnection technology can effectively improve the integration of the printed circuit board.But due to the disadvantages of any layer interconnection technology such as difficult alignment system and long process cycle,Cross-layer micro via technology can be applied to effectively solve this problem.To process cross-layer via holes in rigid-flex printed circuit boards,lasers are required to burn through a variety of different interlayer materials(such as PP,CVL and PI).Because different materials have different absorption rates at different wavelengths(Fig.1).When the same laser processing method is used,the difficulty of controlling the hole shape is greatly increased.In this paper,through different windowing processes and different laser combinations,a crosslayer micro via with 0.1mm aperture can be realized,and it can be applied to a variety of laminated structures,which solves the problem of misalignment of laminated micro via and shortens the processing cycle which greatly improves the integration of electronic products.
作者
王景峰
唐昌胜
Wang Jingfeng;Tang Changsheng
出处
《印制电路信息》
2022年第S01期61-74,共14页
Printed Circuit Information
作者简介
第一作者:王景峰,硕士研究生,2020年8月-至今,就职于无锡深南电路有限公司产品研发部,从事产品研发工作。
