摘要
电子设备的快速发展对挠性覆铜板提出了更薄更轻的要求。本论文研究了铜箔减薄工艺对挠性覆铜板的结构与性能的影响,包括对铜箔减薄前后的微观结构、表面粗糙度、厚度均匀性、耐折性以及剥离强度的研究。结果表明:铜箔经过减薄后,表面粗糙度降低、铜箔厚度均匀性变好、耐折性变好,但波动性增大,剥离强度随铜箔厚度减小而减小,最后展望了未来挠性覆铜板的发展趋势。
Rapid Development of electronic equipment sets higher demands for Flexible Copper Clad Laminate with thinner and lighter feature. This paper has investigated the effects of copper reduction process on product's structures and properties of Flexible Copper Clad Laminate, including microstructure, surface roughness, thickness uniformity, folding quality and peel strength. Results showed that after copper reduction, surface roughness decreased, thickness uniformity was improved, folding quality got better, but volatile. Peel strength decreased with the thickness of copper foil decreasing. At last the development trends of Flexible Copper Clad Laminate in future were explored.
出处
《印制电路信息》
2015年第3期165-168,共4页
Printed Circuit Information
关键词
挠性覆铜板
减薄工艺
结构
性能
Flexible Copper Clad Laminate
Copper Reduction Process
Structure
Properties
