摘要
通过固相反应制备出BaSn1-xSbxO3陶瓷粉末,并将其用醋酸铜溶液浸泡后烘干,随后通过固相反应法制备出BaSn1-xSbxO3CuO复合粉末,然后与Ag粉机械混合制备Ag/BaSn1-xSbxO3CuO复合粉末。同时,采用机械混粉法制备Ag/BaSn1-xSbxO3CuO复合粉末。两种工艺制备的粉末均采用相同烧结工艺制备Ag/BaSn1-xSbxO3CuO触头材料,对所制备触头材料的密度、抗弯强度和电阻率等进行比较。结果表明:采用醋酸铜溶液浸泡BaSn1-xSbxO3陶瓷粉末制备BaSn1-xSbxO3CuO复合粉末,可使CuO更均匀地分布在BaSn1-xSbxO3陶瓷粉末中,极大地促进了粉末的烧结,改善了材料的显微组织,提高了Ag/BaSn1-xSbxO3CuO触头材料的综合性能。
BaSn1-xSbxO3 ceramic powder was synthesized by solid-state reaction and then immersed in cupric acetate and dried to prepare BaSn1-xSbxO3 CuO composite powder by solid-state reaction at first and then prepare Ag/BaSn1-xSbxO3 CuO composite powder by mechanical mixing with Ag powder.Meanwhile,Ag/BaSn1-xSbxO3 CuO composite powder was prepared by mechanical mixing of the powders.And then the composite powders from the above two processes were sintered by the same process to prepare Ag/BaSn1-xSbxO3 CuO electrical contact material.Density,bending strength and resistivity of the two electric contact materials were compared.The results show that CuO can be distributed more uniformly in BaSn1-xSbxO3 composite powder by solution immersion to greatly accelerate powder sintering and improve material microstructure and the comprehensive performance of Ag/BaSn1-xSbxO3 CuO electrical contact material.
出处
《稀有金属与硬质合金》
CAS
CSCD
北大核心
2015年第6期52-55,共4页
Rare Metals and Cemented Carbides
