摘要
聚焦于结构相对复杂的LTCC基板直线型微流道散热效率较低的问题,在微流道封装层上设置了一种金属银导热柱结构,旨在提高直线型微流道散热器的散热效果。首先采用ANSYS有限元数值构建了3种不同流道数量及10种增设金属柱结构的直线型微流道散热器有限元模型,并进行了热-流耦合仿真分析。随后研究了不同流道数量、不同金属柱结构的排列方式和金属柱直径、长度等尺寸对散热效果的影响。仿真结果表明,采用13条流道和0.25 mm直径、0.625 mm长度的金属银导热柱的微流道散热器,在散热性能上表现最为优异。与优化前的直线型微流道结构相比,散热效果提高了8.72%。
Focusing on the issue of relatively low heat dissipation efficiency of complex structures in straight microchannels on LTCC substrates,a metal silver heat conduction column structure is set on the microchannel packaging layer to enhance the heat dissipation effect of straight microchannel heat sinks.Firstly,three different numbers of flow channels and ten metal column structures are added to the straight microchannel heat sink finite element model,which was constructed by using ANSYS finite element numerical simulation,and thermal-fluid coupling simulation analysis is carried out.Then,the impact of different flow channel numbers and different metal column structure arrangements as well as metal column diameters and lengths on the heat dissipation effect is studied.The simulation results show that the microchannel heat sink with 13 flow channels and a metal silver heat conduction column with a diameter of 0.25 mm and a length of 0.625 mm performs the best in heat dissipation performance.Compared with the straight microchannel structure before optimization,the heat dissipation effect is improved by 8.72%.
作者
于浩然
吉喆
严英占
YU Haoran;JI Zhe;YAN Yingzhan(School of Mechanical Engineering,Shijiazhuang Tiedao University,Shijiazhuang 050043,China;Institute of Intelligent Technology,China Electronics Technology Group Corporation,Beijing 100041,China)
出处
《电子科技大学学报》
北大核心
2025年第4期494-500,共7页
Journal of University of Electronic Science and Technology of China
基金
河北省高等学校科学技术研究项目(ZD2022106)。
关键词
散热
LTCC基板
微流道
金属柱热通孔
直线型
heat dissipation
LTCC substrate
micro channel
metal column thermal via
straight type
作者简介
于浩然,主要从事机械设计、工程热物理等方面的研究;通信作者:吉喆,E-mail:jiyouyou1001@126.com。
