摘要
人工智能(AI)芯片是支撑智能技术发展的核心硬件,其技术进步对国家科技创新、产业发展、经济增长具有重要意义。本文从云端智能芯片、边端智能芯片、类脑智能芯片3个方面总结了AI芯片的国际发展趋势,分析了我国AI芯片的应用需求,从芯片设计、制造、封装、测试等方面梳理了相关产业与技术的发展现状及趋势。当前,国产AI芯片的性能、技术、产业链存在短板,亟需开展自主创新与产业协同;国产AI芯片开发面临高成本、长周期的挑战,亟需平衡融资压力并积累发展经验;国内AI芯片领域人才短缺,亟需提高培育质量并控制流失率。为此,论证提出了我国AI芯片的发展路径,即突破技术瓶颈、加速产业化、拓展国际化、实施市场扶持,重点采取技术创新和重点项目建设、新型芯片架构和开源产业生态建设、技术标准体系制定、“产教研”融合等举措,以推动我国AI芯片产业可持续和高质量发展。
Artificial intelligence(AI)chips are the core hardware supporting the development of intelligent technologies and their technological advancements hold significant importance for national scientific innovation,industrial development,and economic growth.This study summarizes the global development trends of AI chips from three perspectives:cloud AI chips,edge AI chips,and neuromorphic chips.It analyzes the application demands of AI chips in China and reviews the current status and development trends of related industries and technologies from the aspects of chip design,manufacturing,and packaging and testing.Currently,AI chips manufactured in China have shortcomings in terms of performance,technologies,and supply chain,necessitating independent innovation and industrial collaboration.The development of these chips also encounters challenges such as high costs and long cycles,requiring stable financing channels and the accumulation of development experiences.Moreover,the AI chip sector in China suffers from a talent shortage,demanding improved training quality and better talent-retaining strategies.Accordingly,this study proposes development paths for China’s AI chip industry,including overcoming technical bottlenecks,accelerating industrialization,expanding internationalization,and implementing market support.Key measures include advancing technological innovation and major project development,fostering new chip architectures and open-source industry ecosystems,establishing technical standards,and promoting the integration of industry,education,and research.These efforts aim to drive the sustainable and high-quality development of China’s AI chip industry.
作者
吴佳青
任大鹏
Wu Jiaqing;Ren Dapeng(China Nanhu Academy of Electronics and Information Technology,Jiaxing 314001,Zhejiang,China)
出处
《中国工程科学》
北大核心
2025年第1期133-141,共9页
Strategic Study of CAE
基金
中国工程院咨询项目“全球未来信息产业发展趋势及我国开辟新领域新赛道战略研究”(2023-XBZD-21)。
关键词
人工智能芯片
芯片设计
芯片制造
芯片封装和测试
产业化
artificial intelligence chips
chip design
chip manufacturing
chip packaging and testing
industrialization
作者简介
通讯作者:任大鹏,中国电子科技南湖研究院高级工程师,研究方向为电子科学与技术,E-mail:562741542@qq.com。
