摘要
基于激光微熔覆和三维直写技术,提出了一种在不可展开曲面上实现电路图形与电阻一体化成型的方法。通过激光粗化增强基材表面结合力,随后采用喷墨直写生成导电图形和曲面电阻,并利用激光固化成型。试验结果显示,该工艺制备的电阻在恒温放置、温度变化和热稳定性试验中表现出良好的稳定性,同时镀层附着力满足应用要求。该技术提高了电阻和电路的集成可靠性,简化了工艺流程,特别适用于复杂曲面结构中的共形天线设计,具备广阔的应用前景。
Using laser micro-cladding and three-dimensional direct writing technology,a method for integrated fabrication of circuit patterns and resistors on non-developable surfaces is proposed.Laser roughening enhances the bonding strength of the substrate surface,followed by inkjet printing to generate conductive patterns and curved resistors,with laser curing for final shaping.The test results indicate that the resistors produced by this process exhibit excellent stability in constant temperature,thermal cycling,and thermal stability tests,while the coating adhesion meets application requirements.This technology improves the integration reliability of resistors and circuits,simplifies the manufacturing process,and holds broad application potential,especially in conformal antennas for complex curved structures.
作者
蒋瑶珮
方杰
崔西会
JIANG Yaopei;FANG Jie;CUI Xihui(The 29th Research Institute of CETC,Chengdu 610036,China)
出处
《电子工艺技术》
2025年第1期4-6,共3页
Electronics Process Technology
关键词
共形电路
电阻
一体化
可靠性
conformal circuit
resistor
integration
reliability
作者简介
蒋瑶珮(1992-),女,硕士,毕业于四川大学,工程师,主要从事共形电路工艺的研究工作。
