摘要
本文归纳了激光直写布线技术的特点 ,重点综述了该技术在电子线路板的应用及在国内外发展的现状 ,并展望了激光直写技术的应用前景。
The basic technique characteristics of laser direct writing were compared with those of the main traditional methods of circuit board-making.According to the difference of the reparation method,laser direct writing can be classified into three kinds:laser chemical vapor deposition,laser induce electroless plating and laser induce solid deposition.Especially,the status and the perspective of laser direct writing in domestic and oversea area were reviewed.Finally,some suggestions about how to develop the application of laser direct writing were presented.
出处
《激光杂志》
CAS
CSCD
北大核心
2001年第6期15-18,共4页
Laser Journal
基金
国家自然科学基金资助项目 (50 0 750 3 0 )
关键词
激光直写
电子线路板
布线技术
laser direct writing,inducing vapor deposition,electroless plating,induce solid deposition
