摘要
在聚酰亚胺(PI)中引入旋转能垒较低的醚键或酮键可以增加分子链的柔性,从而有效地提高PI的黏附力。本文将含柔性醚键的4,4′-二氨基二苯醚(ODA)、含柔性酮键的3,3′,4,4′-二苯甲酮四甲酸二酐(BTDA)、具有非共面扭曲结构的联苯四甲酸二酐(BPDA)和1,4-二氨基苯(PPDA)原位缩聚,通过两步法制备了一种四元共聚型PI膜。结果表明,该共聚型PI膜的玻璃化转变温度为237.1℃,10%热分解温度为538.1℃,拉伸强度为139.64 MPa,断裂伸长率为22.29%,弹性模量为3.12 GPa,将0.5%(相对于单体总质量的百分比)的滑石粉填料在单体聚合之前加入N,N-二甲基乙酰胺(DMAc)溶液内,酰亚胺化后制备的PI膜对铜箔的剥离强度由0.62 N/mm提高到了0.94 N/mm。
The introduction of ether or ketone bonds with lower rotational barrier into polyimide(PI)could increase the flexibility of the molecular chain and effectively improve the stick force of PI.In this paper,with a two-step method,one kind of tetrameric copolymerized PI film was prepared by the in-situ polycondensation of 4,4′-diaminodiphenyl ether(ODA)containing flexible ether bonds,3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride(BTDA)containing flexible ketone bonds,biphenyl tetracarboxylic acid dianhydride(BPDA)with a non-coplanar twisted structure,and 1,4-diaminobenzene(PPDA).The results show that the copolymerized PI film has a glass transition temperature of 237.1℃,a 10%thermal decomposition temperature of 538.1℃,a tensile strength of 139.64 MPa,an elongation at break of 22.29%,and a modulus of elasticity of 3.12 GPa.The peel strength of the PI film after imidization for the copper foil is increased from 0.62 N/mm to 0.94 N/mm,which was prepared by adding the talc filler with a mass fraction of 0.5%to N,N-dimethylacetamide(DMAc)solution prior to the monomer polymerization.
作者
胡彬扬
陆佳莹
张雪平
李桢林
范和平
HU Binyang;LU Jiaying;ZHANG Xueping;LI Zhenlin;FAN Heping(Hubei Institute of Chemistry,Jianghan University,Wuhan 430056,China;Haiso Technology Co.,Ltd.,Wuhan 430074,China)
出处
《塑料工业》
CAS
CSCD
北大核心
2024年第6期159-163,共5页
China Plastics Industry
基金
江汉大学研究生科研创新基金项目(KYCXJJ202312)。
关键词
聚酰亚胺
聚酰胺酸
醚键
酮键
剥离强度
耐锡焊性
挠性覆铜板
Polyimide
Polyamide Acid
Ether Bond
Ketone Bond
Peel Strength
Tin Solder Resistance
Flexible Copper Laminate
作者简介
胡彬扬,女,1996年生,硕士研究生,主要研究方向为电子高分子材料。;通信作者:李桢林,男,1976年生,副研究员,主要研究方向为电子高分子材料。
