摘要
常温居里点陶瓷基正温度系数材料在常温段热控领域具有广阔应用前景,但其存在低温区电阻率过大的问题。基于此,以Ba_(0.64)Sr_(0.36)TiO_(3)为基体并采用固相烧结工艺,研制出低温区电阻率为800Ω·cm的常温居里点PTC材料,分别利用实验和仿真手段对其温控性能进行研究。结果表明:在低温、低电压工况下,该材料可将受控体温度迅速维持在25.6℃附近,而其他加热元件控制温度均偏离常温。该材料热控响应时间少于其他加热元件的50%。在-5~5℃的周期性变化环境中,该材料控温波动幅度最小,只有2.1℃。在真实低温环境下,该材料能将受控体温度快速升至约22.3℃,在12 h内温度波动不到2℃,有效抑制了外界环境对热控过程的干扰。
The room temperature Curie point ceramic-based positive temperature coefficient material has broad application prospects in the field of thermal control at room temperature,but it currently has the problem of large resistivity in the low-temperature region.Based on this,by using Ba_(0.64)Sr_(0.36)TiO_(3) as the matrix and adopting a suitable sintering process,a room-temperature Curie point PTC material with a resistivity of 800Ω·cm in the low-temperature region was developed.Then,the thermal control performance is studied by experiment and simulation respectively.The results show that under low temperature and low voltage conditions,the prepared material can quickly maintain the temperature of the controlled body near 25.6℃,while the control temperature of other heating elements deviates from normal temperature.Additionally,compared to conventional heating elements,the material’s thermal control response time is less than half as fast.In the periodic environment of−5~5℃,the fluctuation range of thermal control is the smallest,only 2.1℃.In the actual low-temperature environment,the material can still quickly raise the body’s temperature to roughly 22.3°C,and the variation is less than 2°C over the course of 12 hours,effectively suppressing the influence of the external environment with the thermal management process.
作者
桑泽康
赵锐
程文龙
SANG Zekang;ZHAO Rui;CHENG Wenlong(School of Engineering Science,University of Science and Technology of China,Hefei 230027,China)
出处
《北京航空航天大学学报》
EI
CAS
CSCD
北大核心
2023年第8期2147-2153,共7页
Journal of Beijing University of Aeronautics and Astronautics
基金
国家自然科学基金(51876198)。
关键词
常温居里点
正温度系数
电阻率
热控
低温环境
room temperature Curie point
positive temperature coefficient
resistivity
thermal control
low temperature environment
作者简介
通信作者:程文龙.E-mail:wlcheng515@163.com。
