摘要
针对国内红外焦平面倒装焊机对高精度光学对位系统的迫切需求,对光学对位系统进行了设计及验证,并对该系统用到的平行调整、光学对位及坐标系误差补偿算法进行研究。文章首先对倒装焊接光学对位工艺进行分析;然后对平行性调整及光学对位算法进行介绍,并根据光学对位系统测试流程,提出更加合理的误差补偿算法;最后,以上述算法为理论依据,设计光学对位系统,其包括准直系统、显微成像系统和激光测距三部分。所设计的光学系统可实现平行性粗调,特征点识别及平行性精调功能。试验结果表明,准直系统准直效果较好,显微成像系统分辨率高,成像质量较好,激光测距系统的测距精度为0.084μm。设计的高精度光学对位系统解决了国内红外焦平面倒装焊机对高精度光学对位系统的迫切需求,已经在国内某型号的倒装焊机中得到应用,对于提高国产高端集成电路的自主研发和生产能力具有非常重要的意义。
Aiming at the urgent demand of high-precision optical alignment systems for a domestic infrared focal plane flip chip bonder,an optical alignment system was designed and verified,and the parallel adjustment,optical alignment and coordinate system error compensation algorithms applied to the system were researched.Firstly,this paper analysed the optical alignment process of a flip chip bonder,then introduced the parallelism adjustment and optical alignment algorithm,and proposed a more reasonable error compensation algorithm according to the test process of the optical alignment system.Finally,based on the above calculation algorithm,the optical alignment system was designed including three parts:a collimation system,a microscopic imaging system and a laser ranging system.The functions of parallel coarse adjustment,feature point recognition and parallel fine adjustment were realized.The experimental results show that the collimation system has a good collimation effect,the microscopic imaging system has high resolution and good imaging quality,and the ranging accuracy of the laser ranging system is 0.084μm.The designed high-precision optical alignment system solves the urgent need of a domestic infrared focal plane flip chip bonder for high-precision optical alignment systems.It has been applied in a certain types of flip chip bonders,and has very important social significance for improving the independent research and development and production capacity of domestic high-end large-scale integrated circuits.
作者
韩冰
马洪涛
许洪刚
闫瑛
鞠德晗
赵纯玉
HAN Bing;MA Hong-tao;XU Hong-gang;YAN Ying;JU De-han;ZHAO Chun-yu(Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun 130033,China;The Second Research Institute of CETC,Taiyuan 030024,China;Jilin Jiangji Special Industries Co Ltd,Jilin 132000,China)
出处
《中国光学（中英文）》
EI
CAS
CSCD
北大核心
2023年第3期587-595,共9页
Chinese Optics
基金
吉林省重点科技研发项目(No.20200401047GX)。
关键词
红外焦平面倒装焊机
光学对位系统
平行调整
激光测距
infrared focal plane flip chip bonder
optical alignment system
parallel adjustment
laser ranging
作者简介
韩冰(1981-),男,吉林长春人,现任中国科学院长春光学精密机械与物理研究所质检中心副主任,副研究员,主要从事光学测试技术研究和检测仪器的开发工作。E-mail:hanbing@ciomp.ac.cn;许洪刚(1991-),男,山东临沂人,硕士,助理研究员,2014年、2018年于东北林业大学分别获得学士、硕士学位,主要从事光电测量技术方面的研究。E-mail:nefuxhg@163.com。
