摘要
电子设备朝着集成化、轻薄化和小型化发展,要求铜板带不仅具有良好的性能,更要满足高精度和高表面质量。本文针对某企业水平连铸生产的铜板坯冷轧后带材表面缺陷展开研究,采用光学显微镜(OM)、扫描电镜(SEM)、能谱(EDS)分析、工业CT等手段观察了各类缺陷宏微观形貌并研究了形成的机理,并对带材表面缺陷产生原因和改善措施进行了探讨,为生产实践提供借鉴。
The development of electronic devices towards integration, thinness and miniaturization requires copper slabs and strips not only to have good performance, but also to meet high precision and high surface quality. The surface defects of copper slabsproduced by horizontal continuous casting after cold rollingin a certain enterprise were studied, the macroscopic morphology of various defects is observed, the mechanism of formation is studied by means of optical microscopy, scanning electron microscopy, energy spectrum analysis and industrial CT, and the causes of surface defects and improvement measures are discussed, which provides reference for production practice.
作者
郑莲宝
徐勇
王松伟
梅伟
刘羽飞
ZHENG Lianbao;XU Yong;WANG Songwei;MEI Wei;LIU Yufei(College of Metallurgy and Energy,North China University of Science and Technology,Tangshan 063210,Chi-na;Shi-Changxu Innovation Center for Advanced Materials,Institute of Metal Research,Chinese Academy of Sci-ences,Shenyang 110016,Liaoning,China;JCC Copper Strip Co.,Ltd.,Nanchang 330096,China)
出处
《铜业工程》
CAS
2023年第1期57-65,共9页
Copper Engineering
关键词
铜板带
水平连铸
冷轧
表面缺陷
工艺优化
copper strip
horizontal continuous casting
cold rolling
surface defects
process optimization
作者简介
郑莲宝(1998-),男,河北定州人,硕士研究生,研究方向:铜板带缺陷研究,E-mail:zlb1998827@163.com;通信作者:王松伟,博士,E-mail:swwang16b@imr.ac.cn。
