摘要
采用粉末冶金法与原位内生法结合制备了(TiC_(p)+GNPs)/Cu复合材料,利用扫描电镜(SEM)、能谱仪(EDS)、X射线衍射(XRD)等研究了球磨时间、球磨速度以及球料比对(TiC_(p)+GNPs)/Cu复合材料微观组织、致密度、导电率以及硬度的影响。结果表明:当球磨时间为15 h、球磨速度为50 r/min、球料比为3∶1时,(TiC_(p)+GNPs)/Cu复合材料组织致密均匀,综合性能良好,导电率达到67.3%IACS,硬度达到71 HBW,致密度达到99.6%。微观组织观察表明:烧结过程中GNPs与Ti粉发生化学反应,在GNPs与Cu基体的界面处生成纳米级TiC_(p)颗粒,有助于进一步提高铜基复合材料的力学性能。
(TiC_(p)+GNPs)/Cu composites were fabricated by powder metallurgy combined with in-situ synthesis method,and the effect of ball-milling time,ball-milling speed and ball-to-powder mass ratio on microstructure,density,electrical conductivity and hardness of the composites were studied by means of scanning electron microscopy(SEM),energy dispersive spectroscopy(EDS)analysis and X-ray diffraction(XRD).The results show that when the milling time is 15 h,the milling speed is 50 r/min and the ball-to-powder mass ratio is 3:1,the microstructure of the(TiC_(p)+GNPs)/Cu composites is dense and uniform,the comprehensive properties are good,the electrical conductivity reaches 67.3%IACS,the hardness reaches 71 HBW and the density reaches 99.6%.The microstructure observation shows that the chemical reaction between GNPs and Ti powder occurs during sintering,and nano TiC_(p)particles are formed at the interface between GNPs and Cu matrix,which is helpful to further improve the mechanical properties of copper matrix composites.
作者
张颖
国秀花
宋克兴
李韶林
冯江
杨豫博
段凯月
段俊彪
ZHANG Ying;GUO Xiu-hua;SONG Ke-xing;LI Shao-lin;FENG Jiang;YANG Yu-bo;DUAN Kai-yue;DUAN Jun-biao(School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China;Henan Key Laboratory of Non-Ferrous Materials Science and Processing Technology,Luoyang 471023,China;Henan Academy of Sciences,Zhengzhou 450052,China)
出处
《材料热处理学报》
CAS
CSCD
北大核心
2022年第7期9-18,共10页
Transactions of Materials and Heat Treatment
基金
河南省科技攻关计划项目(212102210110)
河南省高等学校青年骨干教师培养计划项目(2018GGJS045)
中国工程科技发展战略河南研究院战略咨询研究项目(2021HENZDA02)。
作者简介
张颖(1998-),女,硕士研究生,主要从事载流摩擦磨损领域用铜基复合材料制备研究,E-mail:200320020247@stu.haust.edu.cn;通信作者:国秀花(1981-),女,博士,主要从事载流摩擦领域用高性能铜基复合材料开发研究,E-mail:guoxiuhua@haust.edu.cn。
