摘要
摩尔定律发展趋缓,技术变道迫在眉睫,以功能集成为核心、融合不同工艺节点的异构集成微系统成为了后摩尔时代超越摩尔定律的重要途径,获得国内外的广泛关注。异构集成微系统满足了当今电子系统小型化、高集成、高性能的迫切需求,并且伴随着功能密度的不断提升能够持续为微电子技术的发展注入新的活力。在高性能计算飞速发展的今天,各行业对高性能信息处理、数据运算的需求快速增长,信息处理也成为了当前异构集成微系统应用最广泛、发展最迅速的领域之一。立足当今行业发展现状,针对异构集成微系统在信息处理领域的应用,从先进封装、接口标准、热管理、可靠性等方面介绍了后摩尔时代异构集成微系统关键技术的最新进展,梳理了面向信息处理应用的异构集成微系统典型产品,并讨论了异构集成微系统的未来发展趋势与难点。
The development of Moore's law is slowing down,and the technical route needs to change urgently.Heterogeneous integration microsystem takes functional integration as the core,and can integrate different process nodes,which has become an important way to surpass Moore's law in the More than Moore rea and has gained extensive attention at home and abroad.Heterogeneous integration microsystem can meet the urgent needs of miniaturization,high integration and high performance of electronic systems,and with the continuous improvement of function density can continue to inject new vitality into the development of microelectronics technology.With the rapid development of high performance computing,the demand for high performance information processing and data operation is increasing rapidly in all industries.The information processing has become one of the most widely used and rapidly developed fields of heterogeneous integration microsystem.Based on the current development status of the industry,for the application of heterogeneous integration microsystem in the field of information processing,the latest developments in the key technologies of heterogeneous integration microsystem in the More than Moore rea are introduced in terms of advanced packaging,interface standards,thermal management,and reliability.The typical products of heterogeneous integration microsystem for information processing applications are summarized,and the future development trend and difficulties are discussed.
作者
王梦雅
丁涛杰
顾林
曾燕萍
李居强
张景辉
张琦
孙晓冬
WANG Mengya;DING Taojie;GU Lin;ZENG Yanping;LI Juqiang;ZHANG Jinghui;ZHANG Qi;SUN Xiaodong(China Key System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China)
出处
《电子与封装》
2021年第10期10-29,共20页
Electronics & Packaging
基金
国家自然科学基金(12174085)
江苏省重点研发计划(BE2021003)。
关键词
异构集成
微系统
信息处理
先进封装
接口标准
heterogeneous integration
microsystem
information processing
advanced packaging
interface standard
作者简介
王梦雅(1992—),女,河北石家庄人,硕士,工程师,主要从事微系统仿真技术方面的研究工作。E-mail:wangmengya1015@163.com;通信作者:孙晓冬,sxd.8812@163.com。
