摘要
对某印制电路板组件QFN封装器件在电气装联中出现的焊点桥连缺陷,从焊盘设计、工艺设计进行原因分析。通过元器件焊盘优化设计、焊盘阻焊方式优选、钢网改进设计及焊膏印刷质量提高,解决了缺陷的产生。对塑封QFN元器件和印制电路板进行除潮、检验和环境试验,最终实现了QFN封装器件的高可靠性电气装联。
The defects of solder joint bridging of the QFN in the PCBA are analyzed from pad design and process design. The defects are solved by optimizing the pad design and the pad solder resist method, improving the design of stencil and the printing quality of solder paste. The high reliability electrical assembly of QFN devices is finally achieved through baking, inspection and environment test of plastic QFN and PCB.
作者
刘鹤云
李雪
LIU Heyun;LI Xue(The 27th Research Institute of CETC,Zhengzhou 450047,China)
出处
《电子工艺技术》
2019年第6期359-363,共5页
Electronics Process Technology
关键词
QFN
桥连
焊盘优化设计
钢网改进设计
QFN
bridging
design optimization of pad
design improvement of stencil
作者简介
刘鹤云(1970-),男,技师,技能带头人,主要从事无线电装联工作。
