摘要
QFN封装由于具有良好的电和热性能、体积小、质量轻,在电子产品中被越来越广泛的推广和应用,针对QFN封装元件PCB焊盘设计、焊膏印刷网板开孔设计、贴装工艺、焊接工艺及返修工艺进行了阐述。
QFN（Quad Flat No-Lead） Packing has been widely promoted and applied in the electronic products because of its good electronical and thermal performance, small volume and light weight. In this article, PCB pad design, stencil design for solder paste printing, component mounting process,reflow soldering and rework process of QFN packing device will be system exposited in detail.
出处
《电子工业专用设备》
2015年第2期21-30,共10页
Equipment for Electronic Products Manufacturing
关键词
QFN封装
热焊盘
网板设计
回流焊接
返修
Quad flat No-lead package
Thermal pad
Stencil design
Reflow soldering
Rework process.
