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PVDF/CNTs/Ni复合材料的制备与介电性能 被引量:1

Preparation and Dielectric Properties of PVDF/CNTs/Ni Composites
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摘要 为提高电介质材料介电性能,选用聚偏氟乙烯(polyvinylidene fluoride, PVDF)为基体,碳纳米管(carbon nanotubes, CNTs)和镍粉(nickel powder, Ni)为填料,用溶液共混-热压法制备了PVDF/CNTs/Ni复合材料。采用X射线衍射仪(XRD)表征复合材料的微观结构,发现填料CNTs和Ni的加入促进了PVDF中的α相结构向β相结构转变,这有利于提高复合材料的介电常数。通过对复合材料介电性能的研究发现,当填料质量分数为4.1%时,在102Hz时PVDF/CNTs/Ni复合材料的介电常数可以达到38.9,介电损耗约为5.9。复合材料的介电常数相比纯PVDF皆有显著提高。热导率测试表明,当填料质量分数为5.1%时,复合材料的热导率可达到0.908 W/(m·K)。这为研发高导热性能的电介质复合材料提供了一种思路。 Polyvinylvinylidene fluoride(PVDF) as matrix, carbon nanotubes(CNTs) and nickel powder(Ni) as fillter, PVDF/CNTs/Ni composites were prepared by soluion blending and hot-press processing to improve dielectric properties of dielectric materials. X-ray diffractometry(XRD) was used to characterize the microstructure of the composites. It is found that the addition of CNT and Ni promotes the transformation from α phase to β phase structure in PVDF, and it is beneficial to improve the dielectric constant of the composite.The dielectric properties of composites were studied. The dielectric constant of the PVDF/CNTs/Ni composite can reach 38.9 and the dielectric loss is about 5.9 when the total filler content is 4.1% and frequency at 10~2 Hz. The dielectric constants of the composites are significantly improved compared to that of pure PVDF. The thermal conductivity test shows that the thermal conductivity of the composite can reach 0.908 W/(m·K) when the total content of the filler is 5.1%. It provides an idea for the development of dielectric composites with high thermal conductivity.
作者 武丽荣 杨丹丹 赵玉玉 WU Lirong;YANG Dandan;ZHAO Yuyu(School of Environmental and Materials Engineering,Shanghai Polytechnic University,Shanghai 201209,China)
出处 《上海第二工业大学学报》 2019年第3期171-176,共6页 Journal of Shanghai Polytechnic University
基金 上海第二工业大学校基金(EGD19XQD04) 上海第二工业大学研究生项目基金(EGD18YJ0039)资助
关键词 聚偏氟乙烯 碳纳米管 复合材料 介电常数 热导率 polyvinylidene fluoride carbon nanotubes composite dielectric constant thermal conductivity
作者简介 通信作者:杨丹丹(1980–),女,安徽滁州人,副教授,博士,主要研究方向为储能材料。E-mail:ddyang@sspu.edu.cn。
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