摘要
铟封是一种重要的软金属封接方法,陀螺的玻璃腔体和金属电极采用铟封,实现谐振腔的真空。目前铟封多采用手工操作,较难实现铟环、电极和腔体孔的对准,且封接一致性差,因此本课题研制自动铟封设备,实现铟环和电极与腔体孔的自动对准放置,并施加温度和封接力。本文利用温度控制器、加热棒、Pt电阻设计了温度闭环控制系统,采用位移-力控制策略,通过控制热压头的位移,结合系统刚度,实现了压封力的稳定控制。实验表明,设备的温度控制最大偏差小于±0.3℃,压封力控制偏差小于9 N。
As a kind of soft metal sealing technology,indium packaging is used in the vacuum sealing process of glass-parts and metal-parts to realize a vacuum space in gyroscope in resonant cavities.But the packaging is commonly manually performed so that the center of the indium ring,the axis of the metal-part and the center of the glass-part’s hole are difficult to be ensure in the same line,and the consistent equality of different productions are different to ensure.So an automatic equipment was designed and fabricated.With temperature controller,electrical heaters,and platinum resistences,a simple and effective temperature control system which adopts close-loop strategy is designed to be suitable for the temperature control in the indium packaging process.In the force control part,the position-force strategy is adopted,which means the force is controlled through adjusting the hot embossing head position.According to the experimental results,that the maximum error of the temperature less than±0.3℃and the margin of the force error is 9 N.The system is available for the indium packging.
作者
管亮
李亚玮
王晓东
罗怡
GUANG Liang;LI Yawei;WANG Xiaodong;LUO Yi(Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian Liaoning 116024,China;Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian Liaoning 116024,China)
出处
《电子器件》
CAS
北大核心
2019年第1期41-45,共5页
Chinese Journal of Electron Devices
基金
高档数控机床与基础制造装备科技重大专题项目(2013ZX04001091)
关键词
铟封
热压
温度控制
压封力控制
indium sealing
hot-packaging
temperature control
force control
作者简介
管亮(1990-),男,山东人,硕士研究生,主要研究方向为电极压封控制系统;罗怡(1973-),女,大连理工大学机械工程学院,教授,博士生导师,主要从事微机电系统和微装配技术研究,luoy@dlut.edu.cn。
