摘要
采用不同形貌的金粉分别制成LTCC通孔金浆料,将通孔金浆料与A6生瓷片进行填孔共烧。测试了共烧后金浆料的突出高度,观察了金浆料与生瓷片烧结界面形貌及金浆料的烧结致密性。实验结果表明,金粉形貌为类球型且粒径集中时,金浆料共烧后表面突出高度小于10μm,与生瓷片烧结匹配良好,且烧结金层致密。
The LTCC gold via filles were made by using different morphological gold powder in this paper.The gold paste was used to fill and cofired with A6.The height of the gold via fille cofired was tested.The densibility of gold and raw porcelain film sintering interface were investigated.The results show that when the gold powder form was spherical and particle size concentration.The surface protruding height of gold via fill was less than 10μm.The gold and the raw porcelain plate matched well,and the sintering golden layer was compact.
作者
张建益
党丽萍
王要东
ZHANG Jianyi;Dang Liping;WANG Yaodong(Xi’an Hongxing Electronic Paste Co.,Ltd.Xi’an 710065)
出处
《材料导报》
EI
CAS
CSCD
北大核心
2017年第A02期112-114,共3页
Materials Reports
基金
国家第四批中央专项建设基金(军民融合工程)项目新型功能材料(电子浆料及贵金属粉体)
作者简介
张建益:男,1984年生,硕士,主要从事电子浆料研发和工艺研究 E-mail:zjy1344@126.com。
