摘要
SiP(System in Package)系统级封装技术正成为当前电子技术发展的热点,国际国内许多研究院所和公司已经将SiP技术作为最新的重要发展方向。首先阐述了SiP系统级封装的设计仿真技术及应用,然后结合实际工程项目,详细介绍了SiP最新的设计和仿真方法,并提出SiP设计仿真中应注意的问题。
SiP（System in Package） technology is becoming a hot spot of current electronic technology development, many international and domestic research institutes and companies see SiP technology as an important development direction. This paper introduces SiP design and simulation technology and application, based on practical engineering projects, describes the latest design and simulation methods, and puts forward the problems that should be paid attention to in SiP design and simulation process.
出处
《电子技术应用》
北大核心
2017年第7期47-50,54,共5页
Application of Electronic Technique
作者简介
李扬（1975-），男，硕士，主要研究方向：SiP／PCB设计仿真技术。
