摘要
提出一种新型的金属与聚乙烯薄膜层间有机黏合方法,能够实现薄膜层之间的有机黏合。该方法基于大气压Ar/O2介质阻挡放电对聚乙烯薄膜表面改性预处理,利用射频电感耦合等离子体增强非平衡磁控溅射系统在预处理的聚乙烯薄膜表面镀铜膜。研究结果表明,介质阻挡放电处理聚乙烯薄膜表面,引入了氧原子功能团(C—O,C=O,O—C=O等),导致薄膜表面自由能的增加。此外,这种方法得到的薄膜层之间黏着强度为1.5 MPa;而铜膜与未进行等离子体预处理聚乙烯之间的黏着强度仅为0.8 MPa。此外,SEM照片也显示,经过等离子体预处理后聚乙烯表面的电镀铜膜晶粒较小且分布更均匀。
For a long time, it was found that organic adhesive between Cu and polyethylene （PE） films has enormously potential and possible applications, such as electronic semiconductor, machinery manufacturing, and construction industry. Peel adhesive strength between metal and polymer film layer was insufficient by using traditional hot melt adhesive method. In this paper, a novel method based on atmospheric pressure DBD was proposed to achieve organic adhesive between Cu and PE layers. First, the surface modification of PE film was completed by using atmospheric pressure Ar/O2 DBD. Then, Cu film was deposited with an unbalanced magnetron sputtering system which was enhanced by radio frequency inductively coupled plasma. Experimental results showed that some atomic oxygen functional groups （C-O, C = O, O-C = O, etc. ） were introduced onto PE surface by the DBD plasma treatment, which led to an increase in surface free energy. The peel adhesive strength between Cu and treated PE films was 1.5 MPa, while this value was only 0.8 MPa by the traditional method. SEM pictures also demonstrated that Cu film deposited on the plasma treated PE surface was much smooth and crystal grain was smaller.
出处
《实验室研究与探索》
CAS
北大核心
2017年第4期8-10,15,共4页
Research and Exploration In Laboratory
基金
国家自然科学基金项目(11465013)
江西省科技厅自然科学基金项目(20151BAB212012
20161BAB201013)
关键词
大气压介质阻挡放电
金属与高分子聚合物黏合
极性基团
黏着强度
atmospheric pressure dielectric barrier discharge
organic adhesive between metal and polymer films
polarradical group
peel adhesive strength
作者简介
钱沐杨（1985-），男，江西临川人，博士，副教授，硕士生导师，现主要从事大气压低温等离子体实验诊断及数值仿真研究。Tel：13732915990；E-mail：qianmuyang@ncu．edu．cn
