摘要
新一代大规模集成电路高温动态老化系统的设计是近年来研究的热点。以现场可编程逻辑门阵列作为核心平台,通过高速数据接口,将上位机中的数据传输到老化测试芯片中,同时把老化过程中的相关数据反馈回上位机。通过FPGA软硬件平台验证表明,该数据通信接口设计能够很好地完成集成芯片的老化过程,较传统的静态老化系统有很大的改进和提高。
How to design a new generation of high-temperature dynamic burn-in system LSI is a hot issue in recent years. In this paper, we use field-programmable gate array （FPGA） as a key design platform of the whole system, let the data in host computer transmit to the aging test chip, meanwhile the aging process relevant data feedback to the host computer, through a variety of high-speed data interface. Some experiments and tests based on FPGA show that the data interface can well complete the dynamic bum-in process, has greatly improved and enhanced comparing with the traditional static system.
出处
《杭州电子科技大学学报（自然科学版）》
2015年第6期46-49,共4页
Journal of Hangzhou Dianzi University：Natural Sciences
关键词
集成电路
动态老化
接口设计
现场可编程逻辑门阵列
integrated circuit
dynamic burn-in
interface design
field-programmable gate array
作者简介
胡舜峰（1989-），男，浙江磐安人，在读研究生，电子与通信工程．
通信作者：张福洪教授，E-mail：fuhong@ripsina．com．
