摘要
老化可以筛选出裸芯片的潜在缺陷并因此改善产品的外在质量与可靠性。同时,老化也是非常耗时与耗费人力的。如果对产品的可靠性水平要求较低,要想低成本获得已知良好芯片(KGD),一般是不采用老化程序,但如果想获得高可靠KGD,一定程度的老化是必不可少的。本文将介绍老化的三种通用方法并进行了比较分析。
Bum-in is the process of screening out process dependent latent defects from a product and thereby improving the product＇s outgoing quality and reliability. For normal processes with tower retiabtttty requirements, the product can be produced without burn-in; however, for highly reliable KGD, some level of burn-in is usually necessity. This paper will introduce three different burn-in methods and have a compare within them.
出处
《电子质量》
2007年第2期28-30,共3页
Electronics Quality
