摘要
A novel core-shell structure Ag@Al2O3 nano-particles were synthesized and doped into polyimide as conductive fillers to prepare the composite films with high dielectric properties and low dielectric loss. The morphology and structures of the Ag@Al2O3 nano-particles were characterized by transmission electron microscopy （TEM）, X-ray diffraction （XRD）, and UV-visible spectroscopy. All the results proved that the Ag@Al2O3 nano-parficles had a typical core-shell structure, for the Ag particles were coated by Al2O3 shell and the average sizes ofAg@Al2O3 particles were between 30 to 150 nm. The as-prepared Ag@Al2O3 nanoparticles were doped into the polyimide with different mass fractions to fabricate the Ag@Al2O3/PI composite films via in-situ polymerization process. SEM analysis of composite films showed that the Ag@Al2O3 nano- particles homogeneously dispersed in polyimide matrix with nanoseale. As dielectric materials for electronic packaging systems, the Ag@Al2O3/PI composites exhibited appropriate mechanical properties and erthaneed dielectric properties, including greatly enhanced dielectric constant and just a slight increase in dielectric loss. These improvements were attributed to the core-shell structure of fillers and their fine dispersion in the PI matrix.
A novel core-shell structure Ag@Al2O3 nano-particles were synthesized and doped into polyimide as conductive fillers to prepare the composite films with high dielectric properties and low dielectric loss. The morphology and structures of the Ag@Al2O3 nano-particles were characterized by transmission electron microscopy （TEM）, X-ray diffraction （XRD）, and UV-visible spectroscopy. All the results proved that the Ag@Al2O3 nano-parficles had a typical core-shell structure, for the Ag particles were coated by Al2O3 shell and the average sizes ofAg@Al2O3 particles were between 30 to 150 nm. The as-prepared Ag@Al2O3 nanoparticles were doped into the polyimide with different mass fractions to fabricate the Ag@Al2O3/PI composite films via in-situ polymerization process. SEM analysis of composite films showed that the Ag@Al2O3 nano- particles homogeneously dispersed in polyimide matrix with nanoseale. As dielectric materials for electronic packaging systems, the Ag@Al2O3/PI composites exhibited appropriate mechanical properties and erthaneed dielectric properties, including greatly enhanced dielectric constant and just a slight increase in dielectric loss. These improvements were attributed to the core-shell structure of fillers and their fine dispersion in the PI matrix.
基金
Funded by the National Natural Science Foundation of China(No.51177030)
the National Key Basic Research Development Plan(No.2012CB723308)
the Natural Science Foundation of Heilongjiang Province of China(No.E201224)
作者简介
WENG Ling（翁凌）： Assoc Prof.; Ph D; E-mail： wengling79@163.com
