摘要
利用SMT全自动回流焊机和高温恒温试验箱制备出经2次回流焊时效处理20天的Sn-0.7Cu/Cu焊点试件;采用纳米压入法对其焊点金属间化合物力学性能进行了测试,根据Oliver-Pharr算法,利用接触刚度连续测量技术得到了该化合物(IMC)的杨氏模量及硬度,其硬度为6.43GPa,明显大于同种工况下Cu(2.29GPa)和Sn-0.7Cu(0.32GPa)的硬度;与此同时利用有限元分析软件ANSYS对纳米压入过程进行了反分析,结果表明:与理想弹塑性模型相比,线性强化弹塑性模型能够更准确地描述IMC层的力学本构关系,其初始屈服应力σ0和切线模量EΤ分别为0.90GPa和14.5GPa。
In this paper the Sn-0.7Cu/Cu solder joint subject to 2 reflows and 20d aging is presented using SMT full-automatic reflow machine and high-constant temperature test chamber,then the IMC(intermetallic compound) mechanical properties of the solder joint are measured by using nano-indentation method.Based on the calculation method given by Oliver-Pharr and the continuous stiffness measurement(CSM),the Young's modulus and hardness of IMC are found.Comparison and analysis of mechanical properties between IMC and Sn-0.7Cu/Cu are carried out,results show that the hardness of IMC(6.43GPa) is significantly greater than those of Cu(2.29GPa) and Sn-0.7Cu(0.32GPa).The indentation process is simulated with the ANSYS finite element code,then linear strengthening elastic-plastic constitutive relation of IMC is gained from a series of numerical simulations using the inverse analysis method,the initial yield stress 0 σ and tangent modulus E Τ are 0.90GPa and 14.5GPa respectively.
出处
《应用力学学报》
CAS
CSCD
北大核心
2013年第3期334-338,472,共5页
Chinese Journal of Applied Mechanics
基金
国家自然科学基金(11172195)
山西省国际科技合作项目(2010081016)
关键词
金属间化合物
有限元分析
力学性能
纳米压痕
弹塑性本构
intermetallic compound
finite element analysis
mechanical properties
nanoindentation
elastic-plastic constitutive.
作者简介
第一作者简介：肖革胜，男，1989年生，太原理工大学应用力学与生物医学工程研究所，博士生；研究方向——弹塑性力学。通讯作者：树学峰，E-mail：shuxf@tyut．edu．cn
