摘要
本文采用测定箔带尺寸,硬度,抗拉强度,电阻以及液态钎接金属合金对固态铜的浸润性的方法,研究了快速凝固工艺参数对Cu-Mi-Sn-P合金箔带成型及性能的影响。结果表明。箔带厚度(d)随冷却速度(V_c)的增大而减小;随压力(P)增大而增大;抗拉强度(σ_b)和硬度(HV)明显地与冷却速度假相关。即σ_b和HV随V(?)增大而提高。随P增大而降低。同时也对该箔带进行了光学显微镜及扫描电子显微镜观测。
Effects of rapid solidification processing parameters on the formation of
ribbons and properties of the Cu-Ni-Sn-P alloy have been investigated by
measuring ribbon size,hardness,tensile strength,resistivity of ribbons and
wettability of liquid brazing filler metal alloy on solid copper.All the results
indicate that thickness of ribbons decreases with increasing cooling rate(V_c)
and increases with increasing pressure(p);and that tensile strength(σ_b)and
hardness(HV)strongly depend on cooling rate(V_c),i.e,σ_b and HV increase
with increasing U_c and decrease with increasing p.The optical & scanning
electron microscopic observation of the ribbons has also been performed.
关键词
合金
Cu-Ni-Sn-P
成型
急冷
参数
Cu-Ni-Sn-P alloy
rapid solidification
ribbon formation
rotating rate
pressure
brazing
wettability
