摘要
介绍了晶须补强复合材料的机理,补强机理主要包括:负荷传递、拔出效应、界面解离;讨论上了界面性质、晶须性能对机理的影响;并展望了今后的研究方向。
This paper describes whisker reinforcement mechanism for composites. Reinforcement mechanism mainly involves load transfering,whisker pullout and interface debonding. The effects of interfacial characteristic and whisker properties on the mechanism are discussed. Finally future research directions are suggested.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2000年第6期46-48,共3页
Materials Reports
