摘要
提出了电镀添加剂设计的概念,给出了锡基电子电镀添加剂设计的基本方法。由于电镀添加剂作用的复杂性,要得到性能优异的添加剂,必须从分子水平上对添加剂进行设计,而添加剂在镀层中的夹杂是通过化学夹杂和物理夹杂引起,从分子水平上设计的低吸附型镀锡添加剂可以减少有机分子的夹杂。
The idea about the design of electroplating additives was suggested, and the basic technique of design for the additives used for tin-substrate electronic plating was presented. Due to the complicated interaction between additive molecules, molecular-scale design is necessary to obtain the additives with desired performance. The incorporation of additive into deposit occurs either chemically or physically during deposition. The tin plating additives with low adsorption, which is designed at molecular level, is conducive to reduce the incorporation of organic molecules in deposit.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2012年第2期1-5,共5页
Electroplating & Finishing
关键词
电子电镀
镀锡
添加剂
分子设计
electronic plating
tin electroplating
additive
molecular scale design
作者简介
作者简介：贺岩峰（1957-），男，辽宁人，博士，教授，主要从事电沉积研究。作者联系方式：（E-mail）yfhe@mail．ccut．edu．cn。
